• Build-to-Order
• Component Purchasing and Sourcing
• High-Mix / Low-Volume, Low-Mix / High-Volume PCBA
• Wide Body PCBA Capability
• Clean / No-Clean Processes
• Press Fit Connector / Compliant PIN Assembly
• RoHS/REACH Compliant Manufacturing
• High Complexity & High Density PCBA
• In-House Conformal Coating

Type of Assembly

• THD (Thru-Hole)
• SMT (Surface Mount Technology)
• SMT & THD mixed
• Double-sided SMT and/or THD assembly

Technologies

• IPC Class 1,2,3 Assembly Processes
• μBGA, PGA, LGA, BGA
• PoP and 01005s

Assembly Processes availability

• Lead-Free (RoHS)
• Leaded (SnPb)

Test Capabilities

• Test System Development
• ICT & 5DX
• Functional & AOI
• ESS & Flying Probe
• Burn-In Chambers

Certifications / Standards

• ISO 9001:2015
• ISO 140001:2015
• ISO 13485:2016
• IPC-A-610 Class I, II, III
• UL

Process Capability

• Minimum part size: 01005
• Minimum IC pitch: 0.25 mm
• Minimum BGA ball diameter: 0.2mm
• Minimum BGA ball pitch: 0.25 mm
• Maximum PCB size: 560mm x 330mm 
  (No minimum size limit)
  

Wireless Communication Electronics

Consumer & Navigation Electronics

• Networks – Internet & Wireless
• Satellite – Maritime & Land Terminals
• IoT Products
• Fiber Optic Communications
• Secure Communications
• Radio Frequency (RF) Applications

• LED Lighting
• Power Distribution
• Dashboards & UI devices
• Telematic & Tracking devices
• Safety and security systems
• Aftermarket products

Industrial Electronics

Medical & Health Electronics

• HVAC & Water treatment systems
• Digital Projection electronics
• High speed inspection equipment
• Smart-grid infrastructure
• Biometrics electronics
• Environmental monitoring equipment

• Medical imaging (X-Ray, MRI equipment)
• Laboratory automation products
• Oxygen generation devices
• Emergency Ventilators
• Remote Diagnostics
• Vision assistive systems

 Production Solutions

• Complex Electro-Mechanical
• System Integration & Test (SIT)
• Complete Mechanical Assembly
• Battery Solutions
• EMI/EMS Solutions

• Full Box-Build and CTO
• Cable & Harness Assembly
• Customized Metal, Plastics, Silicone/Rubber Fabrication
• Waterproofing Solutions
• Opto-Electronics Solutions

• Layer count: 10
• Board dimensions: 89.7 x 111.3 mm
• Board material: FR4 High Tg
• Board thickness: 1.8 mm
• Copper thickness: 18 um
• Finishing: Immersion gold (ImAu)

• Layer count: 10
• Board dimensions: 69.5 x 59.1 mm
• Board material: FR4 High Tg
• Board thickness: 1.5 mm
• Copper thickness: 18 um
• Minimum line width: 0.1 mm
• Minimum spacing: 0.08 mm
• Finishing: Immersion gold (ImAu)
• Vias coverage

• Layer count: 4
• Board dimensions: 250 x 233.34 mm
• Board thickness: 1.80 mm
• Board material: FR4 Hihg Tg
• Finishing: HASL (Hot solder leveling)
• Multi-board expandable
  

• Layer count: 14
• Board dimensions: 95 x 52 mm
• Board material: FR4
• Board thickness: 1.7 mm
• Copper thickness: 18/36/36/18
• Finishing: Immersion gold (ImAu)
• Edge plating: Immersion gold (ImAu)
• Impedance: 50 Ohm

• Layer count: 8
• Board dimensions: 95 x 52 mm
• Board material: FR4
• Board thickness: 1.5 mm
• Copper thickness: 18 um
• Finishing: Immersion gold (ImAu)

• Layer count: 4
• Board dimensions: 106 x 70 mm
• Board thickness: 1.45 mm
• Board material: FR4 +Rogers
• Copper thickness: 18/36/36/18
• Silkscreen: Black
• Finishing: Immersion gold (ImAu)

• Layer count: 16
• Board dimensions: 189 x 175 mm
• Board thickness: 1.65 mm
• Board material: FR4 Hihg Tg
• Finishing: Immersion gold (ImAu)
• BGA components

• Layer count: 4
• Board dimensions: 189.5 x 165 mm
• Board material: FR4 Standard
• Board thickness: 1.3 mm
• Copper thickness: 18 um
• Finishing: HASL (Hot solder leveling)
• Press-fit connectors

• Layer count: 10, up to 1500 components
• Board dimensions: 56 x 139.2 mm
• Board material: FR4 High Tg
• Board thickness: 1.3 mm
• Copper thickness: 18/35 um
• Finishing: Immersion gold (ImAu)
• Multiple microBGA
• SMT Populated EMI Shields

Environment-friendly coatings comply with EU's RoHS Directive. Additionally, we have lead-free, halogen-free and low VOC initiatives to support our customers.

Specific features:

Dielectric properties

Thermal stability

Barrier properties

Ultra-thin and pinhole-free, we are providing conformal coatings with exceptional properties, including:

Outstanding dielectric properties

Outstanding chemical and moisture barrier properties

Bio-compatible and bio-stable protection

Ultra-thin, conformal coating of all exposed surfaces

Outstanding multi-layer penetration

Thermal stability up to 450℃ (short-term)

Unparalleled ultraviolet stability

 Rigid Printed Circuit

(PCB)

Ceramic Circuit Boards

(MCPCB)

 Flexible Printed Circuit

(FPC)

 Rigid-Flex Circuit

(RFPC)

Production Capacity